Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUCTION MECHANISM, CUTTING DEVICE, AND MANUFACTURING METHOD FOR CUT PRODUCT
Document Type and Number:
WIPO Patent Application WO/2020/084877
Kind Code:
A1
Abstract:
This suction mechanism (100) comprises: a chamber (34); a jig (33) inside the chamber (34); and a suction unit (31) on the jig (33). The jig (33) comprises a metal form. A cutting device (B) comprises the suction mechanism (100). This manufacturing method for a cut product comprises: a step for cutting an object to be cut (5) using the cutting device (B); and a step for suctioning and transporting the object to be cut (5) that was cut in the cutting step, using the suction mechanism (100).

Inventors:
OZEKI TAKATOSHI (JP)
MIYATA KAZUSHI (JP)
HWANG SUN HA (JP)
ISHIBASHI KANJI (JP)
Application Number:
PCT/JP2019/032391
Publication Date:
April 30, 2020
Filing Date:
August 20, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOWA CORP (JP)
International Classes:
H01L21/301; B23Q3/08; B26D7/20; B28D5/02; B28D7/04
Foreign References:
JPH11274110A1999-10-08
JP2013166137A2013-08-29
JPH06238113A1994-08-30
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF: