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Patent Searching and Data


Title:
SUPPORT, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND SUPPORT PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/143447
Kind Code:
A1
Abstract:
Disclosed in the present application are a support, a photosensitive assembly, a camera module, and a support preparation method. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, a filter element maintained on a photosensitive path of the photosensitive chip, and a support used for mounting the filter element so that the filter element is maintained on the photosensitive path of the photosensitive chip; the support comprises a metal embedded member and a packaging portion wrapping at least a portion of the metal embedded member; a portion of the metal embedded member exposed to the outside extends transversely and inwards from the packaging portion to form a suspension portion, wherein the filter element is mounted on the suspension portion. Thus, the support is integrally combined with the metal embedded member by means of a packaging material, so that the support can achieve better comprehensive performance in terms of overall support strength, mounting flatness, stress reduction, etc.

Inventors:
ZHAO BOJIE (CN)
YU SISI (CN)
CHEN LIEFENG (CN)
HE LINFENG (CN)
MEI ZHEWEN (CN)
GAN DIWEI (CN)
Application Number:
PCT/CN2020/137182
Publication Date:
July 22, 2021
Filing Date:
December 17, 2020
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225
Foreign References:
CN109672806A2019-04-23
CN208940064U2019-06-04
CN109274876A2019-01-25
CN206181192U2017-05-17
US20070030334A12007-02-08
US20160316117A12016-10-27
Attorney, Agent or Firm:
BEIJING TANGSONG IP FIRM (CN)
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