Title:
SURFACE PLATE FOR POLISHING DEVICE, AND POLISHING DEVICE AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/189233
Kind Code:
A1
Abstract:
The present invention relates to an improvement of a surface plate which is used in a polishing device and to which a polishing pad is to be adhered. The surface plate according to the present invention includes a surface plate main body and a release layer composed of a release film or release paper formed on a face of the surface plate main body to which the polishing pad is to be adhered. The release layer has a surface peel force of 0.08 N/50 mm to 5.0 N/50 mm inclusive. The present invention can be suitably used in a polishing device employing a common polishing pad provided with an adhesive. According to the present invention, a fixing operation and an exchange operation for the polishing pad can be made easier than before.
Inventors:
YAJIMA TOSHIYASU (JP)
IIDA MATSUO (JP)
NINOMIYA DAISUKE (JP)
TATSUNO SHIMPEI (JP)
IIDA MATSUO (JP)
NINOMIYA DAISUKE (JP)
TATSUNO SHIMPEI (JP)
Application Number:
PCT/JP2020/008613
Publication Date:
September 24, 2020
Filing Date:
March 02, 2020
Export Citation:
Assignee:
MARUISHI SANGYO CO LTD (JP)
International Classes:
B24B37/12; H01L21/304
Foreign References:
| JP2011000671A | 2011-01-06 | |||
| JP2008162240A | 2008-07-17 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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