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Title:
SURFACE TEXTURE MEASUREMENT DEVICE FOR POLISHING PAD, SURFACE TEXTURE MEASUREMENT METHOD FOR POLISHING PAD, AND SURFACE TEXTURE DETERMINATION METHOD FOR POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2022/158284
Kind Code:
A1
Abstract:
The present invention relates to a surface texture measurement device for a polishing pad that is used for polishing a substrate such as a semiconductor wafer, a surface texture measurement method for a polishing pad, and a surface texture determination method for a polishing pad. A surface texture measurement device (30) comprises a light projecting unit (32) capable of radiating light to a polishing pad (2) from a plurality of radiation angles when the polishing pad (2) is viewed from a polishing surface (2a) of the polishing pad (2), and a light receiving unit (35) capable of receiving reflected light from a plurality of directions reflected at a surface of the polishing pad (2).

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Inventors:
OHSHIMA KOHEI (JP)
MATSUO HISANORI (JP)
KIMBA TOSHIFUMI (JP)
TAKADA NOBUYUKI (JP)
Application Number:
PCT/JP2022/000075
Publication Date:
July 28, 2022
Filing Date:
January 05, 2022
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B37/00; B24B37/20; B24B49/12; B24B49/18; B24B53/00; H01L21/304
Foreign References:
JP2019193970A2019-11-07
JP6465345B22019-02-06
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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