Title:
SYNTHETIC RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/212860
Kind Code:
A1
Abstract:
The synthetic resin molded article (1) is equipped with an electric element part (43) which is a semiconductor substrate extending in the distal direction (D1) and a primary mold part (5) which is a synthetic resin part partially covering the electric element part. The primary mold part has an element-covering part (51) and a main body part (52). The element-covering part has a distal end surface (54) exposed in the distal direction and a first side surface (55) extending along the proximal direction (D2) opposite to the distal direction from the outer edge of the distal end surface, and is provided in the electric element part so as to cover the proximal part side while causing the distal end part side to project from the distal end surface in such a manner that the distal end part is exposed in the distal direction. The main body part has an intermediate surface (56) that is exposed in the distal direction and extends in a direction intersecting the proximal direction from the end part in the proximal direction of the first side surface and a second side surface (57) extending along the proximal direction from the outer edge of the intermediate surface, and is integrally connected to the element-covering part while being disposed closer to the proximal direction side than the element-covering part.
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Inventors:
ISHIKAWA MOTOMI (JP)
YOSHIDA NORIHITO (JP)
IZUMI RYOSUKE (JP)
YAMAKAWA HIROYUKI (JP)
MORI HODAKA (JP)
YOSHIDA NORIHITO (JP)
IZUMI RYOSUKE (JP)
YAMAKAWA HIROYUKI (JP)
MORI HODAKA (JP)
Application Number:
PCT/JP2017/017872
Publication Date:
December 14, 2017
Filing Date:
May 11, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B29C33/14; B29C45/14
Foreign References:
| JP2009166368A | 2009-07-30 | |||
| JP2015064331A | 2015-04-09 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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