SYSTEM AND METHOD FOR 3D ASSOCIATION OF DETECTED OBJECTS

Title:

SYSTEM AND METHOD FOR 3D ASSOCIATION OF DETECTED OBJECTS

Document Type and Number:

WIPO Patent Application WO/2020/017890

Kind Code:

A1

Abstract:

An electronic device, method, and computer readable medium for 3D association of detected objects are provided. The electronic device includes at least one image sensor, an inertial measurement sensor, a memory, and at least one processor coupled to the at least one image sensor, the inertial measurement sensor, and the memory. The at least one processor is configured to capture an image of an environment using the at least one image sensor, detect an object in the captured image, define a bounded area in the image around the detected object, receive head pose data from the inertial measurement sensor, and determine a location of the detected object in a 3D space using the head pose data and the bounded area in the captured image.

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Inventors:

TAMAMA HIDEO (US)
LEE SEOKJUN (US)
GOEL MANISH (US)

Application Number:

PCT/KR2019/008843

Publication Date:

January 23, 2020

Filing Date:

July 17, 2019

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

G06T7/70; G06T7/11; G06T7/13; G06T15/10

Foreign References:

US20170243352A1	2017-08-24
US20160196659A1	2016-07-07
US9201499B1	2015-12-01
KR20120005735A	2012-01-17
US20120306876A1	2012-12-06
US20140139639A1	2014-05-22
US20170243523A1	2017-08-24
US20160196659A1	2016-07-07
US20180025500A1	2018-01-25
US20180005015A1	2018-01-04
US20130187912A1	2013-07-25
US20160055676A1	2016-02-25
US20120249416A1	2012-10-04
US20150381968A1	2015-12-31
US9201499B1	2015-12-01
US20120306867A1	2012-12-06

Other References: