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Title:
SYSTEMS AND METHODS FOR REMOVING OPERATING HEAT FROM A LIGHT EMITTING DIODE
Document Type and Number:
WIPO Patent Application WO2006076208
Kind Code:
A3
Abstract:
Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure and forming heat removal fins thereon; removing the carrier substrate.

Inventors:
DOAN TRUNG TRI
TRAN CHUONG ANH
Application Number:
PCT/US2006/000352
Publication Date:
November 23, 2006
Filing Date:
January 09, 2006
Export Citation:
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Assignee:
SEMILEDS CORP (US)
DOAN TRUNG TRI
TRAN CHUONG ANH
International Classes:
H01L23/34; H01L23/367; H01L33/00; H01L21/58; H01L23/40; H01L33/64
Foreign References:
US20040235210A12004-11-25
US20030164549A12003-09-04
US20020108743A12002-08-15
US20030189215A12003-10-09
US6818531B12004-11-16
US6562648B12003-05-13
US20040077114A12004-04-22
US20040056254A12004-03-25
Other References:
JAEGER R.C.: "Modular Series on Solid State Devices Volume V Introduction to Microelectronic Fabrication", May 1993 (1993-05-01), pages 20 - 21
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