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Title:
TAPE FOR CONNECTING CIRCUITS, REEL OF ADHESIVE, USE OF LAMINATED TAPE AS CIRCUIT CONNECTING MATERIAL, USE OF LAMINATED TAPE FOR MANUFACTURE OF CIRCUIT CONNECTING MATERIAL, AND METHOD FOR MANUFACTURING CIRCUIT-CONNECTED BODY
Document Type and Number:
WIPO Patent Application WO/2012/121292
Kind Code:
A1
Abstract:
A reel (10) of an adhesive has a winding core (1), and an anisotropic conductive tape (5A) wound on the winding core (1). The anisotropic conductive tape (5A) has a tape-like base material (6), and an adhesive layer (8) formed on one surface of the base material. On the surface of the adhesive layer (8), an end mark (18) in a color different from that of the adhesive layer (8) is provided. The winding core (1) and the base material (6) are connected to each other by means of an end tape (12). The cover tape (14) covers a region (5b) where the adhesive layer (8) is not formed, said region being a part of the base material (6). The cover tape (14) and the end mark (18) are subjected to non-slip processing so as to increase friction with the rear surface (6c) of the base material (6). The friction suppresses a slip between portions of the anisotropic conductive tape (5A) wound on the winding core (1).

Inventors:
TATSUZAWA TAKASHI (JP)
FUJINAWA TOHRU (JP)
ISHIKAWA TAKAAKI (JP)
SEKI TAKASHI (JP)
KOBAYASHI KOUJI (JP)
SEKI KOTARO (JP)
Application Number:
PCT/JP2012/055827
Publication Date:
September 13, 2012
Filing Date:
March 07, 2012
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
TATSUZAWA TAKASHI (JP)
FUJINAWA TOHRU (JP)
ISHIKAWA TAKAAKI (JP)
SEKI TAKASHI (JP)
KOBAYASHI KOUJI (JP)
SEKI KOTARO (JP)
International Classes:
B65H75/28; C09J7/02
Foreign References:
JP2010248485A2010-11-04
JP2010222144A2010-10-07
JP2007002103A2007-01-11
JPH0516534A1993-01-26
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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Claims: