Title:
TAPE LAMINATE, MICROFLUIDIC CHIP AND MICROFLUIDIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286681
Kind Code:
A1
Abstract:
A tape laminate is provided which, when used to seal a flow path, enables suppressing gas leakage and contamination while not being prone to peeling due to gas generation. This tape laminate 1 is provided with: a first substrate 2; a first adhesive layer 3 which is provided on a primary surface 2a of the first substrate 2 and which contains a gas generating agent which generates gas with the application of light or heat; and a second adhesive layer 4 which is provided directly or indirectly on a primary surface 3a of the first adhesive layer 3 and which has through-holes 6.
Inventors:
KOBARU SHOUTAROU (JP)
YAMAGUCHI SOU (JP)
UCHIDA KATSURA (JP)
TAKAMATSU TATSUNORI (JP)
YAMAGUCHI SOU (JP)
UCHIDA KATSURA (JP)
TAKAMATSU TATSUNORI (JP)
Application Number:
PCT/JP2022/026903
Publication Date:
January 19, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
SEKISUI MEDICAL CO LTD (JP)
SEKISUI MEDICAL CO LTD (JP)
International Classes:
C09J7/38; B01J19/00; B32B27/00; B32B27/18; C06D5/00; C09J11/06; C09J201/00
Domestic Patent References:
| WO2021125153A1 | 2021-06-24 | |||
| WO2009113567A1 | 2009-09-17 |
Foreign References:
| JP2019070104A | 2019-05-09 | |||
| JP2010202833A | 2010-09-16 | |||
| JP2011021094A | 2011-02-03 | |||
| JP2019108231A | 2019-07-04 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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