Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
TEMPERATURE MEASUREMENT METHOD, TEMPERATURE MEASUREMENT DEVICE, AND THIN FILM FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/163806
Kind Code:
A1
Abstract:
In the temperature measurement method of this invention, a temperature measurement substrate, on which a phase-change film a physical quantity of which changes due to a change in the arrival temperature is laminated, is subjected to a heat treatment, after the temperature measurement substrate has been subjected to heat treatment, the physical quantity of the phase-change film is measured to obtain a measured physical quantity, and the temperature and temperature distribution of the temperature measurement substrate in the heat treatment of the temperature measurement substrate are obtained on the basis of the measured physical quantity and a predetermined relationship between the physical quantity and the temperature.

Inventors:
ISHIBASHI Kenichi (JP)
Application Number:
PCT/JP2022/003293
Publication Date:
August 04, 2022
Filing Date:
January 28, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ULVAC, INC. (JP)
International Classes:
B21C51/00; C01G30/00; H01L21/31; G01K7/16; G01K11/12
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
Download PDF: