Title:
TEMPORARY BONDING GLUE FOR WAFER BACKGRINDING, PREPARATION METHOD OF TEMPORARY BONDING GLUE AND BONDING AND DE-BONDING METHODS
Document Type and Number:
WIPO Patent Application WO/2016/165230
Kind Code:
A1
Abstract:
Disclosed are a temporary bonding glue for wafer backgrinding, a preparation method of the temporary bonding glue and bonding and de-bonding methods. The temporary bonding glue comprises a base resin for producing an adhesive effect, wherein the base resin can be depolymerised into a low molecular compound and/or a linear low polymer under the action of a strong acid, so that an adhesive layer formed by the bonding glue has an obvious depolymerisation reaction under the sufficient impregnation of an acid liquor, that is, the structure of a three-dimensional polymer is damaged, the adhesive layer loses efficacy by means of the generated low molecular compound or the linear low polymer, and the de-bonding efficiency is improved. In addition, the decomposition temperature of the high polymer is not less than 270°C, so that the thermal stability of the adhesive layer is high. In addition, the corrosion resistance of the bonding glue of the present invention is good, and the preparation cost is relatively economical.
More Like This:
Inventors:
SUN RONG (CN)
FANG HAOMING (CN)
ZHANG GUOPING (CN)
DENG LIBO (CN)
FANG HAOMING (CN)
ZHANG GUOPING (CN)
DENG LIBO (CN)
Application Number:
PCT/CN2015/084685
Publication Date:
October 20, 2016
Filing Date:
July 21, 2015
Export Citation:
Assignee:
SHENZHEN INST OF ADV TECH CAS (CN)
International Classes:
C09J161/22; C08G12/08; C09J5/06
Domestic Patent References:
| WO2013187244A1 | 2013-12-19 |
Foreign References:
| JP2008255270A | 2008-10-23 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
北京品源专利代理有限公司 (CN)
Download PDF: