Title:
TEST SOCKET USING AIR GAP
Document Type and Number:
WIPO Patent Application WO/2017/131394
Kind Code:
A1
Abstract:
The present invention relates to a test socket for a semiconductor device using an air gap, the test socket comprising: a shield unit which has a plurality of clearance openings which are vertically perforated apart from each other, and accommodates a probe pin in each of the clearance openings; and holding units which are accommodated and fixed in the shield unit and hold the probe pins. The present invention causes a dielectric between the probe pins to have a dielectric constant close to 1 by using air, thereby being able to expand the outer diameter of a contactor and enhancing high frequency properties.
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Inventors:
CHOI JONG KOOK (KR)
Application Number:
PCT/KR2017/000705
Publication Date:
August 03, 2017
Filing Date:
January 20, 2017
Export Citation:
Assignee:
QUALMAX TESTECH INC (KR)
International Classes:
G01R1/04; G01R1/073; G01R31/28
Foreign References:
| KR101534778B1 | 2015-07-09 | |||
| JP2004325305A | 2004-11-18 | |||
| JP2009156710A | 2009-07-16 | |||
| JP2007178164A | 2007-07-12 | |||
| JP2008145238A | 2008-06-26 |
Attorney, Agent or Firm:
HANSUNG INTELLECTUAL PROPERTY (KR)
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