THERMAL CONDUCTIVE SILICONE COMPOSITION

WIPO Patent Application WO/2023/283819

A1

A thermal conductive silicone composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule and having a viscosity at 25℃ of from 10 to 10,000Pa·S, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, (C) a specific adhesion promoter,(D) at least one thermal conductive filler,(E) at least one filler treating agent, and (F) a hydrosilylation reaction catalyst, with the proviso that the composition does not contain a condensation catalyst. The composition exhibits good self-adhesive properties to various substrates even when it is cured at a relatively low temperature, without impairing its flowability.

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HUANG YAN (CN)
BHAGWAGAR DORAB (US)
WANG LINFEI (CN)
CAO ZHONGWEI (CN)

PCT/CN2021/106191

January 19, 2023

July 14, 2021

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DOW SILICONES CORP (US)
DOW GLOBAL TECHNOLOGIES LLC (US)
HUANG YAN (CN)
BHAGWAGAR DORAB (US)
WANG LINFEI (CN)
CAO ZHONGWEI (CN)

C08L83/07; C09J183/04

WO2021016743A1

2021-02-04

CN101627077A	2010-01-13
CN110088206A	2019-08-02
US20040254275A1	2004-12-16
US20070037997A1	2007-02-15
US20110274935A1	2011-11-10

SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)

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