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Patent Searching and Data


Title:
THERMAL INSULATION STRUCTURE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/053954
Kind Code:
A1
Abstract:
Provided is a thermal insulation structure having a high thermally insulating property, wherein a thermal insulation material has been adhered appropriately onto a base material. In the production of the thermal insulation structure, an adhesive layer comprising a polyimide adhesive is formed over the base material. The adhesive layer is subjected to pre-baking. The surface temperature of the pre-baked adhesive layer is adjusted to between 30°C and 80°C inclusive. While the surface temperature is still between 30°C and 80°C inclusive, a thermal insulation material comprising a porous body is adhered, via the pre-baked adhesive, onto the base material. In a state wherein the thermal insulation material has been adhered onto the base material via the pre-baked adhesive layer, the pre-baked adhesive layer is subjected to baking. In this manner, the pre-baked adhesive layer is transformed into a cured product layer comprising a cured product of the polyimide adhesive, the thermal insulation material becomes adhered on the base material via the cured product layer, forming the thermal insulation structure wherein the cured product layer has a thickness of 0.6 times the thickness of the thermal insulation material, or thinner.

Inventors:
ORIBE AKINOBU (JP)
TOMITA TAKAHIRO (JP)
Application Number:
PCT/JP2018/033593
Publication Date:
March 19, 2020
Filing Date:
September 11, 2018
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
B32B5/18; B32B7/12; B32B27/34
Domestic Patent References:
WO2018020860A12018-02-01
Foreign References:
JP2008267599A2008-11-06
JP2008248735A2008-10-16
JPH0574241A1993-03-26
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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