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Patent Searching and Data


Title:
THERMAL INTERCONNECT SYSTEMS METHODS OF PRODUCTION AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO2004075261
Kind Code:
A3
Abstract:
Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, an adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.

Inventors:
FERY MARK (US)
SUBRAMARIAN JAI (US)
Application Number:
PCT/US2004/004272
Publication Date:
February 03, 2005
Filing Date:
February 13, 2004
Export Citation:
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Assignee:
HONEYWELL INT INC (US)
FERY MARK (US)
SUBRAMARIAN JAI (US)
International Classes:
H01L23/373; (IPC1-7): H01L23/48; H01L23/52; H01L29/40; H01L21/479; H01L21/44
Foreign References:
US4817854A1989-04-04
US5378926A1995-01-03
JPS58202552A1983-11-25
Other References:
See also references of EP 1595289A4
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