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Patent Searching and Data


Title:
THERMALLY CONDUCTIVE MATERIAL AND METHOD FOR PRODUCING SAME, HEAT DISSIPATION STRUCTURE AND METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/182098
Kind Code:
A1
Abstract:
The present invention provides a method for producing a thermally conductive material, said method comprising a stacking step for obtaining a prepreg multilayer body by stacking prepregs, in each of which carbon fibers are oriented in a certain direction, in such a manner that the carbon fibers have the same orientation direction, and subsequently applying a pressure to the prepregs at room temperature.

Inventors:
ARAMAKI KEISUKE (JP)
TOBATA MARINA (JP)
KUBO YUSUKE (JP)
SAITO MASAO (JP)
Application Number:
PCT/JP2021/006748
Publication Date:
September 16, 2021
Filing Date:
February 24, 2021
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
B29C43/34; B29C70/20; B29C70/42; H01L23/36; H01L23/373; B29K101/10; B29K105/08
Domestic Patent References:
WO2018061712A12018-04-05
Foreign References:
JP2002046137A2002-02-12
JP2015164229A2015-09-10
JP2010050239A2010-03-04
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
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