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Title:
THERMALLY CONDUCTIVE RESIN SHEET, LAYERED THERMAL RADIATION SHEET, HEAT-DISSIPATING CIRCUIT BASE BOARD, AND POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/196477
Kind Code:
A1
Abstract:
Provided is a thermally conductive resin sheet having sufficient withstand voltage performance and excellent moisture absorption reflow tolerance that comprises a resin composition containing a crystalline thermoplastic resin having a fusing point of 300°C or higher and a thermally conductive filler, the thermally conductive filler containing aggregated boron nitride particles. In addition, the thermally conductive resin sheet according to another mode of the present invention comprises a resin composition containing between 15% by mass and 40% by mass inclusive of the crystalline thermoplastic resin having a fusing point of 300°C or higher, and between 60% by mass and 85% by mass inclusive of the thermally conductive filler, the thermal conductivity in the thickness direction being 5.0 W/m·K or higher at 25°C.

Inventors:
EBITANI TOSHIAKI (JP)
MATSUI JUN (JP)
Application Number:
PCT/JP2020/012892
Publication Date:
October 01, 2020
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/20; B32B27/00; C08J5/18; C08K3/38; C08L71/00; C08L101/12; H01L23/373; H05K7/20
Domestic Patent References:
WO2015033955A12015-03-12
WO2015119198A12015-08-13
Foreign References:
JP2016098301A2016-05-30
JP2015189823A2015-11-02
JPH08283456A1996-10-29
JP2010137562A2010-06-24
JP2013508491A2013-03-07
JP2017036415A2017-02-16
JPH0320354A1991-01-29
JPH07157569A1995-06-20
JP2008524362W
JP2012255055A2012-12-27
Other References:
"Boron nitride that hasa card-house structure", CERAMICS, vol. 51, no. 10, 1 October 2016 (2016-10-01), JP , pages 717 - 718, XP009531006, ISSN: 0009-031X
"Ceramics", vol. 43, 2008, CERAMIC SOCIETY OF JAPAN
See also references of EP 3950328A4
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
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