Title:
THERMALLY CONDUCTIVE RESIN SHEET, LAYERED THERMAL RADIATION SHEET, HEAT-DISSIPATING CIRCUIT BASE BOARD, AND POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/196477
Kind Code:
A1
Abstract:
Provided is a thermally conductive resin sheet having sufficient withstand voltage performance and excellent moisture absorption reflow tolerance that comprises a resin composition containing a crystalline thermoplastic resin having a fusing point of 300°C or higher and a thermally conductive filler, the thermally conductive filler containing aggregated boron nitride particles. In addition, the thermally conductive resin sheet according to another mode of the present invention comprises a resin composition containing between 15% by mass and 40% by mass inclusive of the crystalline thermoplastic resin having a fusing point of 300°C or higher, and between 60% by mass and 85% by mass inclusive of the thermally conductive filler, the thermal conductivity in the thickness direction being 5.0 W/m·K or higher at 25°C.
Inventors:
EBITANI TOSHIAKI (JP)
MATSUI JUN (JP)
MATSUI JUN (JP)
Application Number:
PCT/JP2020/012892
Publication Date:
October 01, 2020
Filing Date:
March 24, 2020
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; B32B27/20; C08J5/18; C08K3/38; C08L71/00; C08L101/12; H01L23/373; H05K7/20
Domestic Patent References:
| WO2015033955A1 | 2015-03-12 | |||
| WO2015119198A1 | 2015-08-13 |
Foreign References:
| JP2016098301A | 2016-05-30 | |||
| JP2015189823A | 2015-11-02 | |||
| JPH08283456A | 1996-10-29 | |||
| JP2010137562A | 2010-06-24 | |||
| JP2013508491A | 2013-03-07 | |||
| JP2017036415A | 2017-02-16 | |||
| JPH0320354A | 1991-01-29 | |||
| JPH07157569A | 1995-06-20 | |||
| JP2008524362W | ||||
| JP2012255055A | 2012-12-27 |
Other References:
"Boron nitride that hasa card-house structure", CERAMICS, vol. 51, no. 10, 1 October 2016 (2016-10-01), JP , pages 717 - 718, XP009531006, ISSN: 0009-031X
"Ceramics", vol. 43, 2008, CERAMIC SOCIETY OF JAPAN
See also references of EP 3950328A4
"Ceramics", vol. 43, 2008, CERAMIC SOCIETY OF JAPAN
See also references of EP 3950328A4
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
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