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Title:
THERMOELECTRIC CONVERSION ELEMENT MODULE AND METHOD FOR PRODUCING THERMOELECTRIC CONVERSION ELEMENT MODULE
Document Type and Number:
WIPO Patent Application WO/2021/079462
Kind Code:
A1
Abstract:
A thermoelectric conversion element module according to the present invention is provided with: a first insulating substrate; a second insulating substrate that is provided above the first insulating substrate; an n-type thermoelectric element that is provided between the first insulating substrate and the second insulating substrate; a p-type thermoelectric element that is provided between the first insulating substrate and the second insulating substrate; a first electrode that is provided on the back surface of the second insulating substrate, while electrically connecting the top edge of the n-type thermoelectric element and the top edge of the p-type thermoelectric element to each other, said back surface facing the first insulating substrate; a second electrode that is provided on the upper surface of the first insulating substrate, while being electrically connected to the bottom edge of the n-type thermoelectric element; a third electrode that is provided on the upper surface of the first insulating substrate, while being electrically connected to the bottom edge of the p-type thermoelectric element; a first metal layer that is provided beneath the first insulating substrate; a first insulating layer that is provided beneath the first metal layer; a second metal layer that is provided on top of the second insulating substrate; and a second insulating layer that is provided on top of the second metal layer.

Inventors:
TAKAHIRA SATOSHI (JP)
KUROKI KIMIHARU (JP)
Application Number:
PCT/JP2019/041709
Publication Date:
April 29, 2021
Filing Date:
October 24, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L35/34; H01L35/30; H02N11/00
Domestic Patent References:
WO2007063755A12007-06-07
WO2019009202A12019-01-10
Foreign References:
JP2012044133A2012-03-01
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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