Title:
THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THERMOELECTRIC MODULE POST
Document Type and Number:
WIPO Patent Application WO/2021/075286
Kind Code:
A1
Abstract:
This thermoelectric module comprises: a lower substrate; an upper substrate arranged above and opposing the lower substrate; a plurality of p-type and n-type thermoelectric elements arranged between the lower substrate and the upper substrate; first electrodes which are arranged on a lower surface of the lower substrate and an upper surface of the upper substrate and form a series circuit by alternately sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode which is provided on the lower substrate and connects the thermoelectric element at the end of the series circuit to a post. The post includes a post body formed from titanium and a titanium passive film that covers a side surface of the post body.
Inventors:
MATSUNAMI HIROYUKI (JP)
TANAKA TETSUSHI (JP)
TANAKA TETSUSHI (JP)
Application Number:
PCT/JP2020/037686
Publication Date:
April 22, 2021
Filing Date:
October 05, 2020
Export Citation:
Assignee:
KELK LTD (JP)
International Classes:
H01L35/10; H01L35/34
Foreign References:
| JP2003008084A | 2003-01-10 | |||
| JP2005050862A | 2005-02-24 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
Download PDF: