Title:
THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2017/056549
Kind Code:
A1
Abstract:
A thermoelectric module according to an embodiment of the present invention is provided with: a pair of support substrates 11, 12 having regions that face each other; wiring conductors 21, 22 provided to one of the main surfaces of each of the pair of support substrates 11, 12, the main surfaces provided with the wiring conductors 21, 22 facing each other; a plurality of thermoelectric elements 3 provided between the aforementioned main surfaces of the pair of support substrates 11, 12; a lead member 4 joined to the wiring conductor 21 provided to one support substrate 11 from the pair of support substrates 11, 12; and a coating material 5 for coating the portion 41 of the one support substrate 11 that is joined to the lead member 4. The one support substrate 11 has a first projection part 111 including the portion 41 joined to the lead member 4, and the other support substrate 12 has a second projection part 121 which does not overlap with the portion 41 joined to the lead member 4 when viewed from a direction perpendicular to one of the main surfaces. The coating material 5 is joined to the first projection part 111 and the second projection part 121.
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Inventors:
FURUKAWA TOMOHIRO (JP)
Application Number:
PCT/JP2016/065569
Publication Date:
April 06, 2017
Filing Date:
May 26, 2016
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L35/10; H01L35/32; H02N11/00
Foreign References:
| JPH0520353U | 1993-03-12 | |||
| JP2008244239A | 2008-10-09 | |||
| JP2010165840A | 2010-07-29 | |||
| JP2009129968A | 2009-06-11 |
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