Title:
THERMOPLASTIC RESIN COMPOSITION, FIBER-REINFORCED RESIN SUBSTRATE, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/054251
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermoplastic resin composition having exceptional thermal stability and mechanical characteristics, a fiber-reinforced resin substrate, and a molded article obtained therefrom. In order to achieve the abovementioned purpose, an embodiment of the present invention has the structure described below. Specifically, a thermoplastic resin composition including a thermoplastic resin (A) having an electron-donating group, and a transition metal compound (B), wherein the transition metal compound (B) includes a nickel compound (B1) and a copper compound (B2), the complete decomposition temperature of the copper compound (B2) is 400°C or higher, and the copper compound (B2) has a nickel content of 0.001-4 parts by mass (inclusive) and a copper content of 0.001-4 parts by mass (inclusive) with respect to 100 parts by mass of the thermoplastic resin (A) having an electron-donating group.
Inventors:
MASUNAGA ATSUSHI (JP)
HAYASHI SHINYA (JP)
ISHITAKE KENJI (JP)
TOMIOKA NOBUYUKI (JP)
HAYASHI SHINYA (JP)
ISHITAKE KENJI (JP)
TOMIOKA NOBUYUKI (JP)
Application Number:
PCT/JP2020/034418
Publication Date:
March 25, 2021
Filing Date:
September 11, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08K5/17; C08J5/04; C08K3/105; C08K3/11; C08K3/16; C08K3/24; C08K7/02; C08L81/02; C08L101/02
Domestic Patent References:
| WO2014208418A1 | 2014-12-31 |
Foreign References:
| JPH06207103A | 1994-07-26 | |||
| JP2012158747A | 2012-08-23 | |||
| JP2016169276A | 2016-09-23 | |||
| JP2018053196A | 2018-04-05 | |||
| JP2016011382A | 2016-01-21 | |||
| JP2010031080A | 2010-02-12 | |||
| JPH01163262A | 1989-06-27 | |||
| JP2014227367A | 2014-12-08 | |||
| JPH06207102A | 1994-07-26 |
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