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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
Document Type and Number:
WIPO Patent Application WO/2020/105730
Kind Code:
A1
Abstract:
This thermoplastic resin composition contains: a (meth)acrylic acid ester copolymer (A) which is obtained by polymerizing a vinyl monomer mixture (m1) that contains 50% by mass or more but less than 80% by mass of a (meth)acrylic acid ester monomer and 12-39% by mass of an aromatic vinyl monomer; a hindered amine compound (C) which has a molecular weight of 200-1,800; and an ultraviolet absorbing compound (D) which has a maximum absorption wavelength at 250-300 nm. This thermoplastic resin composition may also contain a graft copolymer (B); relative to 100 parts by mass of the total of the (meth)acrylic acid ester copolymer (A) and the graft copolymer (B), the content of the hindered amine compound (C) is 0.4-1.8 parts by mass and the content of the ultraviolet absorbing compound (D) is 0.1-1.6 parts by mass; and the total of the hindered amine compound (C) and the ultraviolet absorbing compound (D) is 2.0 parts by mass or less.

Inventors:
ATSUTA HIROYUKI (JP)
Application Number:
PCT/JP2019/045753
Publication Date:
May 28, 2020
Filing Date:
November 22, 2019
Export Citation:
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Assignee:
TECHNO UMG CO LTD (JP)
International Classes:
C08K5/17; C08L33/10; C08L51/04
Foreign References:
JP2004346237A2004-12-09
JP2005132987A2005-05-26
JP2012052054A2012-03-15
JP2015537090A2015-12-24
JP2019019236A2019-02-07
JP2018219572A2018-11-22
JP2016117782A2016-06-30
Other References:
See also references of EP 3885403A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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