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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/020148
Kind Code:
A1
Abstract:
A thermoplastic resin composition which is characterized by containing from 0.0001 part by mass to 0.09 part by mass of (B) spherical fine particles having an average particle diameter of from 500 nm to 2,500 nm with respect to 100 parts by mass of (A) a transparent thermoplastic resin.

Inventors:
OGAWA YASUSHI (JP)
KUSUMOTO NOBUHIKO (JP)
IRIE YASUYUKI (JP)
Application Number:
PCT/JP2020/027682
Publication Date:
February 04, 2021
Filing Date:
July 16, 2020
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Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08K7/18; C08L101/12
Domestic Patent References:
WO2010113422A12010-10-07
WO2015125690A12015-08-27
WO2014097901A12014-06-26
WO2019172243A12019-09-12
Foreign References:
JP2013197024A2013-09-30
JP2012134022A2012-07-12
JP2020132666A2020-08-31
JP2020117705A2020-08-06
JP2005232442A2005-09-02
JPH08259687A1996-10-08
JPH08245782A1996-09-24
JP2016125038A2016-07-11
JP351A
JP360A
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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