Title:
THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING SAME, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/235465
Kind Code:
A1
Abstract:
A thermosetting composition which contains the component (A-1), the component (A-2), the component (B) and the component (C) described below, and which has a viscosity of 5-200 Pa·s at a shear rate of 10 s-1 at 25°C and a viscosity of 1-50 Pa·s at a shear rate of 100 s-1 at 25°C as determined in accordance with JIS K7117-2.
(A-1) an acrylate compound or a methacrylate compound, to which a substituted or unsubstituted, alicyclic hydrocarbon group having 6 or more ring-forming carbon atoms is ester-bonded
(A-2) a compound which is represented by formula (I-1)
(B) spherical silica
(C) a white pigment
Inventors:
OBATA YUTAKA (JP)
ITO KATSUKI (JP)
MORI HARUHIKO (JP)
ITO KATSUKI (JP)
MORI HARUHIKO (JP)
Application Number:
PCT/JP2019/022135
Publication Date:
December 12, 2019
Filing Date:
June 04, 2019
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C08F220/18; B29C45/53; C08F220/30; C08F290/06; C08L33/04
Foreign References:
| JP2016008230A | 2016-01-18 | |||
| JP2003155318A | 2003-05-27 | |||
| JPH11335597A | 1999-12-07 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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