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Patent Searching and Data


Title:
THERMOSETTING COMPOSITION, RESIN FILM, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/101271
Kind Code:
A1
Abstract:
Provided is a thermosetting composition comprising an alkylsilyl peroxide and a radically-polymerizable compound, wherein the alkylsilyl peroxide is at least one selected from the group consisting of compounds represented by general formula (1) and compounds represented by general formula (2). The thermosetting composition has excellent dielectric properties and makes it possible to obtain a cured product having excellent heat resistance.

Inventors:
TAKUMA KANAKO (JP)
HAYASHI MASAKI (JP)
Application Number:
PCT/JP2023/039617
Publication Date:
May 16, 2024
Filing Date:
November 02, 2023
Export Citation:
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Assignee:
NOF CORP (JP)
International Classes:
C08F290/06; B32B15/08; C08J5/24; H01L23/14
Foreign References:
JPS6071631A1985-04-23
JPS61195113A1986-08-29
JPS6151066A1986-03-13
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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