Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION AND CURED FILM
Document Type and Number:
WIPO Patent Application WO/2019/239533
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting resin composition which is inexpensive, has good curing properties, can be used in a variety of applications, and which, as a result of using a transesterification reaction as part of the curing reaction, facilitates the control of the physical properties thereof, and can reduce costs, while maintaining equivalent curing performance to the prior art. [Solution] A thermosetting resin composition containing: at least one hardening component (A) selected from the group consisting of polyisocyanate compounds, melamine resin and alkoxy silane compounds; a resin component (B) having an alkyl ester group and a hydroxyl group; and a transesterification catalyst (C).

Inventors:
MORIWAKI YUYA (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
Application Number:
PCT/JP2018/022637
Publication Date:
December 19, 2019
Filing Date:
June 13, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
C08L33/14; C08G12/32; C08G18/67; C08K5/5415
Foreign References:
JPH05239406A1993-09-17
JPH1088010A1998-04-07
JP2001026747A2001-01-30
JP2001040010A2001-02-13
JP2001261715A2001-09-26
JP2017071666A2017-04-13
JPH09302271A1997-11-25
Attorney, Agent or Firm:
YAGI, Toshiyasu (JP)
Download PDF: