Title:
THERMOSETTING RESIN COMPOSITION AND CURED FILM
Document Type and Number:
WIPO Patent Application WO/2019/240216
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting resin composition which is inexpensive, has good curing properties, can be used in a variety of applications, and which, as a result of using a transesterification reaction as part of the curing reaction, facilitates the control of the physical properties thereof, and can reduce costs, while maintaining equivalent curing performance to the prior art. [Solution] A thermosetting resin composition comprising: at least one hardening component (A) selected from among the group consisting of polyisocyanate compounds, melamine resin and alkoxysilane compounds; a resin component (B) having an alkyl ester group and a hydroxyl group; and a transesterification catalyst (C).
Inventors:
MORIWAKI YUYA (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
Application Number:
PCT/JP2019/023459
Publication Date:
December 19, 2019
Filing Date:
June 13, 2019
Export Citation:
Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
C08L33/14; C08G12/32; C08G18/62
Domestic Patent References:
WO2001021611A1 | 2001-03-29 |
Foreign References:
JPH05239406A | 1993-09-17 | |||
JPH1088010A | 1998-04-07 | |||
JP2001026747A | 2001-01-30 | |||
JP2001040010A | 2001-02-13 | |||
JP2001261715A | 2001-09-26 | |||
JP2017071666A | 2017-04-13 | |||
JPH05239403A | 1993-09-17 | |||
JPH05263035A | 1993-10-12 | |||
JPH09100439A | 1997-04-15 | |||
JPH11279229A | 1999-10-12 | |||
JPH09302271A | 1997-11-25 |
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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