Title:
THERMOSETTING RESIN COMPOSITION, AND EPOXY RESIN MATERIAL, COMPOSITE MATERIAL THEREOF, AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/030454
Kind Code:
A1
Abstract:
The present invention provides a thermosetting resin composition, comprising an epoxy curing agent, an epoxy resin component, a free radical initiator, a reactive diluent, a toughening agent, and a polyurethane compound. The epoxy resin component comprises an epoxy group so as to perform an open-loop addition reaction under the action of the epoxy curing agent. Each molecule of the reactive diluent comprises at least one acrylate group so as to perform a free radical polymerization reaction under the action of the free radical initiator. In every 100 parts of the epoxy resin component, the number of parts of the free radical initiator is 0.01-7, the number of parts of the reactive diluent is 3-60, the number of parts of the epoxy curing agent is 1-120, the number of parts of the toughening agent is 1-15, and the number of parts of the polyurethane compound is 3-15. The present invention solves the problem of reduced tensile strength and bending strength after the epoxy resin curing once the toughening agent is added. The present invention further provides an epoxy resin material, a composite material thereof and a preparation method therefor.
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Inventors:
CHEN CUIPING (CN)
JI GANG (CN)
JIANG LEI (CN)
JI MINGLEI (CN)
JIA RONGSHU (CN)
JI GANG (CN)
JIANG LEI (CN)
JI MINGLEI (CN)
JIA RONGSHU (CN)
Application Number:
PCT/CN2022/116550
Publication Date:
March 09, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
DAWN TIANHE MATERIALS TECH SHANGHAI CO LTD (CN)
International Classes:
C08L63/00; C08G59/56; C08J3/24; C09J4/02
Foreign References:
| CN114213607A | 2022-03-22 | |||
| JP2021147551A | 2021-09-27 | |||
| CN107428913A | 2017-12-01 | |||
| JP2016199673A | 2016-12-01 | |||
| CN104559808A | 2015-04-29 | |||
| EP0432923A1 | 1991-06-19 | |||
| CN109843968A | 2019-06-04 |
Attorney, Agent or Firm:
SHANGHAI IFUTURE INTELLECTUAL PROPERTY LAW FIRM (CN)
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