THERMOSETTING RESIN COMPOSITION FOR LDS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Title:

THERMOSETTING RESIN COMPOSITION FOR LDS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/130012

Kind Code:

A1

Abstract:

This thermosetting resin composition for LDS, which is used for laser direct structuring, contains (A) a thermosetting resin, (B) an inorganic filler, (C) a non-conductive metal compound which forms a metal nucleus upon irradiation of an active energy ray, and (D) a coupling agent, and is configured such that the component (A) contains one or more resin that is selected from the group consisting of epoxy resins and bismaleimide resins. This thermosetting resin composition for LDS satisfies at least one of the conditions 1 and 2 described below. Condition 1: The ratio of particles having a particle diameter of from 1 μm to 20 μm (inclusive) in the component (B) is from 40% by volume to 95% by volume (inclusive) based on the entirety of the component (B). Condition 2: The collapse angle of this thermosetting resin composition for LDS is 35° or less.

Inventors:

KODA MASAYA (JP)
ENDO MASASHI (JP)

Application Number:

PCT/JP2019/049527

Publication Date:

June 25, 2020

Filing Date:

December 18, 2019

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)

International Classes:

C08L63/00; C08K3/013; C08K3/22; C08K3/36; C08K5/54; C08L39/04

Domestic Patent References:

WO2017199639A1

2017-11-23

Foreign References:

JP2016098415A	2016-05-30
JP2017513794A	2017-06-01
JP2017179184A	2017-10-05
JP2018024812A	2018-02-15
JP2015134903A	2015-07-27
JP2015163682A	2015-09-10
JP2006233337A	2006-09-07
JP2015134903A	2015-07-27
JP2015163682A	2015-09-10
JP2017513794W
JP2004534408W
JP2018236604A	2018-12-18
JP2019025899A	2019-02-21
JP2019025900A	2019-02-21

Other References: