Title:
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/117758
Kind Code:
A1
Abstract:
According to the present invention, a thermosetting resin composition constituting at least a portion of a heat dissipation insulation member interposed between a heating element and a heat radiator comprises: (A) an epoxy resin; (B) a thermosetting resin (excluding the epoxy resin (A)); (C) a phenoxy resin having a mesogenic structure in the molecule; (D) thermally conductive particles; and (E) an organosiloxane compound.
Inventors:
KASHINO TOMOMASA (JP)
ENDO TADASUKE (JP)
OBA AKIYOSHI (JP)
ENDO TADASUKE (JP)
OBA AKIYOSHI (JP)
Application Number:
PCT/JP2020/045827
Publication Date:
June 17, 2021
Filing Date:
December 09, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/38; C08J5/18; C08L63/00; H01L23/373
Domestic Patent References:
WO2018030079A1 | 2018-02-15 |
Foreign References:
JP2019108516A | 2019-07-04 | |||
JP2019189840A | 2019-10-31 | |||
JP2019077759A | 2019-05-23 | |||
JP2017066336A | 2017-04-06 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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