Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/069783
Kind Code:
A1
Abstract:
Provided is an inexpensive thermosetting resin composition having suitable curability and in which the curing reaction is transesterification that makes it possible to use said thermosetting resin composition for a variety of uses. The thermosetting resin composition contains (A) an ester compound having at least two alkyl ester groups in the molecule thereof, a compound (B) having at least two hydroxyl groups in the molecule thereof, and (C) a transesterification catalyst (C).

Inventors:
MORIWAKI YUYA (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
Application Number:
PCT/JP2018/035911
Publication Date:
April 11, 2019
Filing Date:
September 27, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
C08L33/14; C09D129/04; C09D133/04; C09D135/02; C09J129/04; C09J133/04; C09J135/02
Foreign References:
JPH0770400A1995-03-14
JPH08291264A1996-11-05
JPH09302274A1997-11-25
JP2005029660A2005-02-03
JP2007100108A2007-04-19
US5260356A1993-11-09
JPH08188728A1996-07-23
JPH09302271A1997-11-25
JP2002520429A2002-07-09
JP2013028772A2013-02-07
JPH0959543A1997-03-04
JPH02147675A1990-06-06
Other References:
See also references of EP 3623424A4
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
Download PDF: