Title:
THICKNESS MEASUREMENT DEVICE AND THICKNESS MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2022/054605
Kind Code:
A1
Abstract:
A thickness measurement device for measuring the thickness of a base, the thickness measurement device comprising: a base holding part for holding a center portion of the base; a measurement part for measuring the thickness of the base held by the base holding part; and a movement mechanism for moving the base holding part and the measurement part relatively in a horizontal direction, wherein the base holding part is provided with a cutout portion which radially extends from a center portion to an outer end portion of the base holding part, by means of the cutout portion the measurement part being capable of moving relatively forward and backward.
Inventors:
TAMURA TAKESHI (JP)
KODAMA MUNEHISA (JP)
KANEKO TOMOHIRO (JP)
KODAMA MUNEHISA (JP)
KANEKO TOMOHIRO (JP)
Application Number:
PCT/JP2021/031465
Publication Date:
March 17, 2022
Filing Date:
August 27, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G01B11/06; B24B49/02; G01B21/08; H01L21/304
Foreign References:
| JP2003075124A | 2003-03-12 | |||
| JP2015205367A | 2015-11-19 | |||
| JPH0649958U | 1994-07-08 | |||
| JP2009156686A | 2009-07-16 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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