Title:
THICKNESS MEASURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/180171
Kind Code:
A1
Abstract:
A thickness measuring apparatus according to an embodiment of the present invention comprises: a main board on which a control module and a power supply module for supplying power are mounted; a magnet wheel which is mounted and protrudes from the main board planarly, and rotates in a first direction; a first robot arm which extends from a first edge of the main board and moves on a plane vertical to the first direction; a second robot arm which extends from a first edge of the main board and moves on a plane vertical to a second direction; a sub-board which is interposed between the first robot arm and second robot arm, is connected to the first robot arm and second robot arm, and rotates about the first direction as the rotation axis by means of the movement of the first robot arm and second robot arm; and a thickness measuring sensor which is mounted on the side of the sub-board and protrudes in the second direction vertical to the first direction.
Inventors:
KIM DONG CHAN (KR)
JUNG GWANG MIN (KR)
JUNG GWANG MIN (KR)
Application Number:
PCT/KR2020/095018
Publication Date:
September 10, 2020
Filing Date:
March 05, 2020
Export Citation:
Assignee:
HS TECH CO LTD (KR)
International Classes:
G01B11/02; B08B1/00; B25J9/00; B63B3/14; G01B11/06
Foreign References:
| JP2001012934A | 2001-01-19 | |||
| JP2003148926A | 2003-05-21 | |||
| KR20130021803A | 2013-03-06 | |||
| JP2010122209A | 2010-06-03 | |||
| KR20150045292A | 2015-04-28 |
Attorney, Agent or Firm:
LIM, Jeong Hoon (KR)
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