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Patent Searching and Data


Title:
THREE-DIMENSIONAL PROCESSING METHOD FOR LAMINATED FILM AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/013048
Kind Code:
A1
Abstract:
Provided is a three-dimensional processing method in which a molding processing unit performs cold compression-molding on a laminated film in a thickness direction of the laminated film so as to project a compression-molded portion to an outer surface side, the laminated film having at least an inner surface film having a large elongation on an innermost surface and an outer surface film having a small elongation on an outer surface side , the three-dimensional processing method being characterized in that the molding processing unit is made of a material which can achieve an elastic deformation area wider than the widest elastic deformation area in a plane direction of a film constituting the laminated film. According to the three-dimensional processing method of the present invention, a projection portion having a wide working width can be formed in the compression-molded portion.

Inventors:
AIKAWA TAKAYUKI (JP)
NYUU KEISUKE (JP)
Application Number:
PCT/JP2019/026452
Publication Date:
January 16, 2020
Filing Date:
July 03, 2019
Export Citation:
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Assignee:
TOYO SEIKAN KAISHA LTD (JP)
International Classes:
B31F1/07; B31B70/88
Foreign References:
JP2014046655A2014-03-17
JP2016132212A2016-07-25
JPH01111096A1989-04-27
JP2010076132A2010-04-08
Attorney, Agent or Firm:
ONO, Hisazumi et al. (JP)
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