Title:
THREE-DIMENSIONAL STACKED PROCESSING SYSTEMS
Document Type and Number:
WIPO Patent Application WO/2022/056757
Kind Code:
A1
Abstract:
Aspects of the present technology are directed toward three-dimensional (3D) stacked processing systems characterized by high memory capacity, high memory bandwidth, low power consumption and small form factor. The 3D stacked processing systems include a plurality of processor chiplets and input/output circuits directly coupled to each of the plurality of processor chiplets.
Inventors:
NIU DIMIN (US)
HAN WEI (US)
GUAN TIANCHAN (CN)
WANG YUHAO (US)
LI SHUANGCHEN (US)
ZHENG HONGZHONG (US)
HAN WEI (US)
GUAN TIANCHAN (CN)
WANG YUHAO (US)
LI SHUANGCHEN (US)
ZHENG HONGZHONG (US)
Application Number:
PCT/CN2020/115776
Publication Date:
March 24, 2022
Filing Date:
September 17, 2020
Export Citation:
Assignee:
ALIBABA GROUP HOLDING LTD (CN)
International Classes:
H01L25/18; G11C11/4074; H01L23/52; H01L23/60; H01L25/065
Foreign References:
| US20190050325A1 | 2019-02-14 | |||
| US20180366442A1 | 2018-12-20 | |||
| US9337138B1 | 2016-05-10 | |||
| CN108090022A | 2018-05-29 | |||
| CN110010601A | 2019-07-12 |
Attorney, Agent or Firm:
BEIJING TSINGYUANHUI INTELLECTUAL PROPERTY LAW FIRM (CN)
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