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Patent Searching and Data


Title:
THREE-DIMENSIONAL STRUCTURAL BODY MANUFACTURING METHOD, MOLD USED IN SAME, AND ELECTRIC CONTACT
Document Type and Number:
WIPO Patent Application WO/2017/069136
Kind Code:
A1
Abstract:
In the present invention, using a mold having a shape in which the center portion of a prescribed region is recessed, the surface shape of a leading end of a three-dimensional structure is pressed into a resin plate to mold the same, and a metal layer is formed on the surface of the molded plate, thereby manufacturing a three-dimensional structural body.

Inventors:
NAGATA HITOSHI (JP)
FAN LIWEN (JP)
Application Number:
PCT/JP2016/080902
Publication Date:
April 27, 2017
Filing Date:
October 19, 2016
Export Citation:
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Assignee:
JAPAN ELECTRONIC MATERIALS (JP)
RITSUMEIKAN TRUST (JP)
HORIGUCHI IRON WORKS INC (JP)
International Classes:
G01R1/067; B29C33/42; C25D5/02
Domestic Patent References:
WO2000059274A12000-10-05
Foreign References:
JP2006337202A2006-12-14
JP2008089377A2008-04-17
JPH09267337A1997-10-14
JP2004291472A2004-10-21
JPH07191057A1995-07-28
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
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