Title:
TIRE MOLD AND TREAD
Document Type and Number:
WIPO Patent Application WO2004062898
Kind Code:
A3
Abstract:
The present invention is a process for making an entire truck tire tread comprising the steps of securing tread mold segments comprising plates to a flat backing, placing a blank tread on the mold segments, and pressing the blank tread against the mold segments. The invention also comprises this process wherein the tread mold segments comprising plates are formed by the steps of machining at least one side of a plate so that the peak to peak variation of the plate surface is less than 5 microns, securing the plates to a flat backing; and machining a reverse tread pattern onto the secured plates. The present invention also comprises a process for making a mold for a tire tread comprising the steps of securing tread mold segments comprising plates of at least two different thicknesses to a flat backing, and machining a reverse tread pattern comprising ridges onto the secured plates, where the thickness of the plate under the ridge is chosen so that the width to height ratio of a ridge on a plate is not less than 1:10.
Inventors:
PAN CHINGLIN (US)
LEFEVRE DANIEL (US)
LEFEVRE DANIEL (US)
Application Number:
PCT/US2003/039785
Publication Date:
August 26, 2004
Filing Date:
December 15, 2003
Export Citation:
Assignee:
MICHELIN SOC TECH (FR)
MICHELIN RECH TECH (CH)
PAN CHINGLIN (US)
LEFEVRE DANIEL (US)
MICHELIN RECH TECH (CH)
PAN CHINGLIN (US)
LEFEVRE DANIEL (US)
International Classes:
B29C33/30; B29D30/56; (IPC1-7): B29D30/56; B29C33/10; B29C33/30
Domestic Patent References:
| WO2000020184A1 | 2000-04-13 |
Foreign References:
| EP0403443A2 | 1990-12-19 | |||
| US5656107A | 1997-08-12 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31)
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