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Patent Searching and Data


Title:
TRANSCRIPTION MATERIAL, ACTIVE ENERGY LINE CURABLE RESIN CONSTITUENT USED IN HARD COAT LAYER OF TRANSCRIPTION MATERIAL, AND METHOD FOR MANUFACTURING ABRASION-RESISTANT MOLDED COMPONENT USING TRANSCRIPTION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2013/015378
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a transcription material with a stable quality and high productivity, an active energy line curable resin constituent used in a hard coat layer of the transcription material, and a method for manufacturing an abrasion-resistant molded component using the transcription material. According to the transcription material of the present invention, at least the hard coat layer, a pattern layer, and an adhesion layer are laminated in said order on a base substance sheet having release characteristics. The hard coat layer contains a polymer with a (meta)acrylic equivalent of 200g/eq to 360g/eq and a weight-average molecular weight of 5,000 to 90,000 and silica sol as an active ingredient, and is formed of the active energy line curable resin constituent which does not contain a hardener. The active energy line curable resin constituent has not been subjected to a thermal crosslinking reaction.

Inventors:
KATO YASUHIRO (JP)
ETORI YU (JP)
DOI SHINTARO (JP)
YAMADA MASAYOSHI (JP)
SATO YOSHINOBU (JP)
SAITO MAYUKO (JP)
Application Number:
JP2012/069016
Publication Date:
January 31, 2013
Filing Date:
July 26, 2012
Export Citation:
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Assignee:
NISSHA PRINTING (JP)
ARAKAWA CHEM IND (JP)
KATO YASUHIRO (JP)
ETORI YU (JP)
DOI SHINTARO (JP)
YAMADA MASAYOSHI (JP)
SATO YOSHINOBU (JP)
SAITO MAYUKO (JP)
International Classes:
B32B27/30; B32B27/20; C08F299/00; C09D4/00; C09D7/12
Domestic Patent References:
WO2011058904A12011-05-19
WO2009075086A12009-06-18
Foreign References:
JP2001205752A2001-07-31
JPH1058895A1998-03-03
JP2011057905A2011-03-24
JP2009286972A2009-12-10
JP2010163576A2010-07-29
JP2005271229A2005-10-06
JP2007091961A2007-04-12
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
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Claims: