Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
TRANSFER DEVICE, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/130914
Kind Code:
A1
Abstract:
The present invention makes it possible to cause a reference surface member to reliably contact a lateral surface of a recessed part of a mold, and provides a transfer device 13 that transfers a molding object W1 to a mold 14 having a recessed part 15M formed on a mold surface side on which the molding object W1 is placed. The transfer device 13 is provided with: a position reference mechanism 30 that has a reference surface PR serving as a reference to position the molding object W1 placed on the mold 15; and a molding object movement mechanism 40 that moves the molding object W1 placed on the mold 15 toward the reference surface PR. The position reference mechanism 30 comprises: a reference surface member 31 that has the reference surface PR and is provided so as to be able to contact a lateral surface 15M1 of the recessed part 15M; a lift mechanism 32 that contacts a bottom surface 15M2 of the recessed part 15M to make the reference surface member 31 separated from a bottom surface 15M2 of the recessed part 15M; and a reference surface movement mechanism 33 that, with the reference surface member 31 separated from the bottom surface 15M2 of the recessed part 15M by the lift mechanism 32, moves the reference surface member 31 toward the lateral surface 15M1 of the recessed part 15M.

Inventors:
YOSHIDA SYUHEI (JP)
Application Number:
PCT/JP2021/042824
Publication Date:
June 23, 2022
Filing Date:
November 22, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOWA CORP (JP)
International Classes:
B29C45/14; B29C33/12; H01L21/56
Foreign References:
JP2020064919A2020-04-23
CN108481693A2018-09-04
JP2019031051A2019-02-28
JP2016192500A2016-11-10
JP2013084709A2013-05-09
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
Download PDF: