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Patent Searching and Data


Title:
TRANSPARENT CONDUCTIVE FILM, AND PRODUCTION METHOD FOR TRANSPARENT CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2021/187581
Kind Code:
A1
Abstract:
A transparent conductive film (X) according to the present invention comprises a transparent resin substrate (10) and a transparent conductive layer (20) in this order in the thickness direction (T). In an in-plane direction perpendicular to the thickness direction (T), the transparent conductive film (X) has a first direction exhibiting the maximum thermal shrinkage rate as a result of heat-treating under the heating conditions of 165°C for 60 minutes, and a second direction perpendicular to the first direction. A first thermal shrinkage rate T1 of the transparent conductive film (X) in the second direction as a result of heat-treating under said heating conditions and a second thermal shrinkage rate T2 of the transparent resin substrate (10) in the second direction as a result of heat-treating under said heating conditions satisfies 0%≤T1-T2<0.12%.

Inventors:
KARASUDA TAISUKE (JP)
FUJINO NOZOMI (JP)
TAKAO HIROYUKI (JP)
Application Number:
PCT/JP2021/011156
Publication Date:
September 23, 2021
Filing Date:
March 18, 2021
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B9/00; B32B7/00; B32B7/022; B32B7/023; B32B7/025; B32B7/028; B32B9/04; C23C14/08; C23C14/20; C23C14/34; G02F1/1333; G02F1/1343; G06F3/041; H01B1/08; H01B1/20; H01B5/14; H01B5/16; H01B13/00; H01L31/0224; H01Q1/38; H01Q1/52; H05K9/00
Foreign References:
JP2017042967A2017-03-02
JPS61279003A1986-12-09
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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