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Patent Searching and Data


Title:
TWO-SIDE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/208967
Kind Code:
A1
Abstract:
The present invention is a two-side polishing method for polishing the two sides of a wafer that is disposed between a polishing pad which is affixed to an upper surface of a lower platen and a polishing pad which is affixed to a lower surface of an upper platen provided above the lower platen, the method being characterized in that, if an absolute value for the difference between an inner peripheral section gap and an outer peripheral section gap between the two polishing pads is used as a pad gap, the pad gap during the polishing of the two sides of the wafer is larger than the pad gap during the dressing of the two polishing pads. Due to this configuration, a two-side polishing method is provided that achieves both an improved quality level (treatment accuracy) and extended cloth life.

Inventors:
TANAKA YUKI (JP)
Application Number:
PCT/JP2020/007893
Publication Date:
October 15, 2020
Filing Date:
February 27, 2020
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/005; B24B37/08; B24B37/12; B24B37/14; B24B53/017; H01L21/304
Foreign References:
JP2017001151A2017-01-05
JP2018176304A2018-11-15
JP2014110433A2014-06-12
JP2011175726A2011-09-08
JP2002046058A2002-02-12
JP2014207450A2014-10-30
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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