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Title:
ULTRASONIC FINGERPRINT MODULE, FABRICATION METHOD THEREFOR AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/081777
Kind Code:
A1
Abstract:
An ultrasonic fingerprint module (100), a fabrication method therefor and an electronic device. The ultrasonic fingerprint module (100) comprises an ultrasonic detection layer (10) and an ink layer (20); the ultrasonic detection layer (10) has an ultrasonic receiving surface (11); the ink layer (20) is provided on the side of the ultrasonic detection layer (10) far from the ultrasonic receiving surface (11); the ink layer (20) is used to reflect ultrasonic waves emitted by the ultrasonic detection layer (10); the ink layer (20) contains a resin material and carbon powder particles; the average particle size of the carbon powder particles is 0.5 microns to 5 microns; and the mass ratio of the carbon powder particles is 2.5% to 15%. The ink layer (20) may reflect the ultrasonic waves emitted from the ultrasonic detection layer (10) toward a fingerprint to be detected, so that an ultrasonic signal received by the fingerprint is strengthened, thereby improving the strength of the ultrasonic signal emitted by the ultrasonic fingerprint module (100) toward the fingerprint, and improving the efficiency of fingerprint recognition.

Inventors:
LIU XUANXUAN (CN)
ZHU HUANGYI (CN)
Application Number:
PCT/CN2019/114126
Publication Date:
May 06, 2021
Filing Date:
October 29, 2019
Export Citation:
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Assignee:
NANCHANG O FILM BIO IDENTIFICATION TECH CO LTD (CN)
International Classes:
G06K9/00
Domestic Patent References:
WO2019204328A12019-10-24
Foreign References:
CN109492504A2019-03-19
CN207182310U2018-04-03
CN109492500A2019-03-19
CN207182317U2018-04-03
CN107652739A2018-02-02
US20180268187A12018-09-20
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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