Title:
ULTRASONIC FINGERPRINT MODULE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/081776
Kind Code:
A1
Abstract:
An ultrasonic fingerprint module (100), a manufacturing method therefor, and an electronic device. The ultrasonic fingerprint module (100) comprises an ultrasonic detection layer (10) and a reflection layer (20). The ultrasonic detection layer (10) has an ultrasonic receiving surface (11). The reflection layer (20) is provided on one surface of the ultrasonic detection layer (10) located away from the ultrasonic receiving surface (11). The reflection layer (20) is used to reflect ultrasonic waves emitted from the ultrasonic detection layer (10). The reflection layer (20) comprises a defoamer used to remove bubbles in the reflection layer (20) during manufacturing, and remove bubbles in the finally formed reflection layer (20). The defoamer removes the bubbles in the reflection layer (20) so as to reduce a surface roughness of the reflection layer (20), thereby ensuring that the reflection layer (20) reflects an ultrasonic signal uniformly, and improving fingerprint recognition efficiency of the ultrasonic fingerprint module (100).
Inventors:
LIU XUANXUAN (CN)
ZHU HUANGYI (CN)
ZHU HUANGYI (CN)
Application Number:
PCT/CN2019/114125
Publication Date:
May 06, 2021
Filing Date:
October 29, 2019
Export Citation:
Assignee:
NANCHANG O FILM BIO IDENTIFICATION TECH CO LTD (CN)
International Classes:
G06K9/00
Domestic Patent References:
| WO2008022072A2 | 2008-02-21 |
Foreign References:
| CN109492500A | 2019-03-19 | |||
| CN207182310U | 2018-04-03 | |||
| CN109492504A | 2019-03-19 | |||
| CN107403129A | 2017-11-28 | |||
| CN109829419A | 2019-05-31 | |||
| CN109492477A | 2019-03-19 | |||
| US20190087621A1 | 2019-03-21 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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