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Patent Searching and Data


Title:
ULTRASONIC MACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/216720
Kind Code:
A1
Abstract:
Provided is an ultrasonic machining apparatus that is capable of improving microfabrication machining precision with respect to a workpiece. This ultrasonic machining apparatus 10 comprises: a base 12; an ultrasonic unit 18 that has a stage 14 positioned such that the base 12 serves as a base point, and a support column 16, and that generates micro vibrations along the support column 16; and a holder 20 that supports the ultrasonic unit 18 along the support column 16. The ultrasonic machining apparatus 10 is characterized in that the holder 20 is provided with a plurality of guide rollers 22 that guide the vibrations generated by the ultrasonic unit 18 along the standing direction of the support column16, and at least one of the plurality guide rollers 22 (for example, guide roller 22c) has attached thereto a biasing means 36 that generates a biasing force toward the axial direction of the ultrasonic unit 18.

Inventors:
TAKASAKI MITSUYA (JP)
Application Number:
PCT/JP2018/019802
Publication Date:
November 29, 2018
Filing Date:
May 23, 2018
Export Citation:
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Assignee:
MITSUI E & S HOLDINGS CO LTD (JP)
International Classes:
B24B37/00; B24B1/04
Foreign References:
JPS62225280A1987-10-03
JPH0226388A1990-01-29
JPS6458464A1989-03-06
JPH0453610A1992-02-21
JPS5994591A1984-05-31
CN202062262U2011-12-07
JP2012035374A2012-02-23
JP2014014826A2014-01-30
Other References:
See also references of EP 3632615A4
Attorney, Agent or Firm:
MURAKAMI Tomokazu (JP)
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