Title:
ULTRASONIC SOLDERING METHOD AND ULTRASONIC SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/073299
Kind Code:
A1
Abstract:
[Purpose] The present invention relates to an ultrasonic soldering method and an ultrasonic soldering device. The purpose of the present invention is to make it possible to solder a section to be soldered to an electrode or similar that does not include Ag or Pb, or includes a reduced amount thereof. [Structure] The present invention has a preheating step in which either a substrate to which a paste that does not include Ag, Cu, or Pb has been applied to an arbitrary section thereof and sintered, or the paste section on the substrate is preheated to a first prescribed temperature that is lower than the melting point of a solder; and an ultrasonic soldering step in which a soldering iron tip section is brought into contact with, or moved while in contact with, the paste section of the substrate that was preheated to the first prescribed temperature in the preheating step, while the soldering iron tip section that contacts the paste section is adjusted to a second prescribed temperature, said second prescribed temperature allowing the supplied solder to melt while ultrasonic waves are applied to the soldering iron tip section and, while ultrasonic waves are not applied, being lower than the temperature at which the solder melts, thereby soldering the paste section.
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Inventors:
KAMISAKO KOICHI (JP)
ARAI KATSUYA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
YOKOYAMA SHUHEI (JP)
ARAI KATSUYA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
YOKOYAMA SHUHEI (JP)
Application Number:
PCT/JP2016/079948
Publication Date:
May 04, 2017
Filing Date:
October 07, 2016
Export Citation:
Assignee:
ARTBEAM CO LTD (JP)
TOKYO UNIV OF AGRICULTURE AND TECH TLO CO LTD (JP)
TOKYO UNIV OF AGRICULTURE AND TECH TLO CO LTD (JP)
International Classes:
B23K3/02; B23K1/00; B23K1/19; B23K31/02; H01L31/0224; H01L31/05; H01L31/068; H05K3/34; B23K101/36
Foreign References:
| JP2015165487A | 2015-09-17 | |||
| JP2014524153A | 2014-09-18 | |||
| JP2012510714A | 2012-05-10 | |||
| JP5725180B2 | 2015-05-27 |
Attorney, Agent or Firm:
OKADA Morihiro (JP)
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