Title:
UNDERLAY FOR POLISHING PAD, AND POLISHING METHOD USING SAID UNDERLAY
Document Type and Number:
WIPO Patent Application WO/2019/208605
Kind Code:
A1
Abstract:
The present invention relates to a sheet-like underlay to be installed between a polishing pad and a surface plate when the polishing pad is fixed onto the surface plate. The underlay is a novel assistance member in which, in a surface that contacts the polishing pad, at least one annular groove is formed along an outer edge of the underlay, and in which further at least one discharge groove extending from an annular groove formed on the outer-most edge side in the direction of the outer edge of the underlay and having an opening at an outer edge end portion is formed. After the underlay is fixed onto the surface plate, a polishing pad may be fixed to the underlay, whereby peeling and the like of the polishing pad due to a polishing slurry can be suppressed.
Inventors:
YAJIMA TOSHIYASU (JP)
NINOMIYA DAISUKE (JP)
NINOMIYA DAISUKE (JP)
Application Number:
PCT/JP2019/017335
Publication Date:
October 31, 2019
Filing Date:
April 24, 2019
Export Citation:
Assignee:
MARUISHI SANGYO CO LTD (JP)
International Classes:
B24B37/12; B24B37/22; H01L21/304
Foreign References:
| JP2000288918A | 2000-10-17 | |||
| US20020002027A1 | 2002-01-03 | |||
| JP2015503232A | 2015-01-29 | |||
| JP2006339573A | 2006-12-14 | |||
| JP2000354951A | 2000-12-26 | |||
| JP2014108498A | 2014-06-12 | |||
| JP2012240189A | 2012-12-10 | |||
| JP2016159395A | 2016-09-05 | |||
| JP2012106328A | 2012-06-07 | |||
| JP2000306870A | 2000-11-02 | |||
| JP2015205389A | 2015-11-19 | |||
| JP2013034018A | 2013-02-14 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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