Title:
VARISTOR ENCAPSULATION MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/127151
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of varistors, and in particular to a varistor encapsulation molding method, which comprises the following steps: S1, placing a varistor component into a bottom die of a forming mold; S2: injecting silicone rubber into the forming mold, and performing a mold closing operation after injection; S3: performing a heat-curing operation on the closed forming mold; and S4: opening the mold after heat-curing, so as to obtain an encapsulation-molded varistor. By means of performing injection molding using silicone rubber, the external dimensions of a varistor are managed and controlled by a forming mold; and the external dimensions are stable, and the tolerance thereof can be controlled within ±0.1 mm. In addition, by means of using a silicone rubber injection molding process, a welding electrode surface of a varistor component does not need to be protected prior to encapsulation.
Inventors:
XU YUNHUI (CN)
ZHANG XIANGGUI (CN)
SU JUN (CN)
CHEN XIAOHUI (CN)
ZHANG XIANGGUI (CN)
SU JUN (CN)
CHEN XIAOHUI (CN)
Application Number:
PCT/CN2021/112579
Publication Date:
June 23, 2022
Filing Date:
August 13, 2021
Export Citation:
Assignee:
XIAMEN SET ELECTRONICS CO LTD (CN)
International Classes:
H01C7/10; C08K3/22; C08K7/26; C08L83/05; C08L83/07; H01C17/02
Foreign References:
| CN112712952A | 2021-04-27 | |||
| CN112679958A | 2021-04-20 | |||
| CN1253656A | 2000-05-17 | |||
| CN107513368A | 2017-12-26 | |||
| CN103333506A | 2013-10-02 | |||
| CN107910145A | 2018-04-13 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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