VIBRATION CUTTING PROCESS DIAGNOSTIC DEVICE

Title:

VIBRATION CUTTING PROCESS DIAGNOSTIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2016/059729

Kind Code:

A1

Abstract:

The purpose of the present invention is to obtain a vibration cutting process diagnostic device such that, when performing a vibration cutting process for processing the cross sectional shape of an object to be processed into a non-perfect circular shape by reciprocating a tool, whether the process can be performed under a speed condition designating a vibration cutting can be diagnosed prior to the process. A vibration cutting process diagnostic device that makes a diagnosis as to whether a vibration cutting process for processing the cross sectional shape of an object to be processed into a non-perfect circular shape can be performed by a reciprocating motion of a movable axis is provided with: a frequency analysis unit (4) that computes, on the basis of shape data (1) which are processing shape data of a work as the object to be processed and a processing speed set value (2), a frequency component included in a movable axis position command signal; and a processing diagnosis implementation unit (5) that makes a diagnosis as to the possibility of processing the shape data (1) with the processing speed set value (2), on the basis of the frequency component and a movable axis parameter (3) of the movable axis.

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Inventors:

NAGAOKA KOTARO (JP)
TANABE AKIRA (JP)
AZUMA TOSHIHIRO (JP)

Application Number:

PCT/JP2014/077748

Publication Date:

April 21, 2016

Filing Date:

October 17, 2014

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

G05B19/406; B23B1/00; B23B5/24

Foreign References:

JPH02205439A	1990-08-15
JPH0236045A	1990-02-06
JPH03178703A	1991-08-02
JPH01271102A	1989-10-30

Attorney, Agent or Firm:

SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)

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