Title:
VIBRATION SENSOR AND AUDIO DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/258174
Kind Code:
A1
Abstract:
The present application provides a vibration sensor and an audio device. The vibration sensor comprises a cavity having a sidewall, an elastic film mounted on the sidewall, and an MEMS chip having a back cavity. The MEMS chip is received within the cavity and mounted on the elastic film. The sidewall comprises a side surface attached to the elastic film. The side surface recesses toward a direction away from the MEMS chip to form a recessed cavity. The elastic film covers the recessed cavity and is provided with a through hole. The through hole makes the recessed cavity and the back cavity of the MEMS chip be communicated with each other. The vibration sensor of the present application features a small height and high sensibility.
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Inventors:
ZHANG JINYU (CN)
Application Number:
PCT/CN2019/093338
Publication Date:
December 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; G01H11/06
Foreign References:
| CN109916502A | 2019-06-21 | |||
| CN104219610A | 2014-12-17 | |||
| CN208386931U | 2019-01-15 | |||
| US20110198714A1 | 2011-08-18 |
Attorney, Agent or Firm:
GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE (CN)
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