Title:
VINYL-BASED RESIN PARTICLES AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/182113
Kind Code:
A1
Abstract:
The present invention provides vinyl-based resin particles that, if used as a pore-forming material for a thermosetting resin, can form uniform holes in a film of the thermosetting resin. Specifically, the present invention provides vinyl-based resin particles to be used in forming pores in a thermosetting resin, wherein the temperature at which 10% mass reduction has occurred when the temperature has been raised 10°C/minute in an air atmosphere is 300–350°C and the mass reduction ratio after heating at 350°C for 5 hours in an air atmosphere is 85–100%.
Inventors:
NISHIUMI KENGO (JP)
HARADA RYOSUKE (JP)
HARADA RYOSUKE (JP)
Application Number:
PCT/JP2019/012089
Publication Date:
September 26, 2019
Filing Date:
March 22, 2019
Export Citation:
Assignee:
SEKISUI PLASTICS (JP)
International Classes:
C08J3/12; C08F2/22; C08F257/02; C08J9/26
Domestic Patent References:
| WO2015029483A1 | 2015-03-05 | |||
| WO2013030977A1 | 2013-03-07 |
Foreign References:
| JPS63278943A | 1988-11-16 | |||
| JP2001210142A | 2001-08-03 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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